Bumping and Packaging Sources
"Amkor offers state-of-the-art capability in electroplated solder technologies in multiple strategic locations (Taiwan, Korea, and the US). The Taiwan facility is a world class solder bumping line with HVM production capability for 200 mm and 300 mm wafers. High lead, eutectic, and lead-free solder compositions (all low alpha) are production certified. In addition, the facility offers repassivation and multi-layer redistribution processes."
Flip Chip International
"FlipChip International is a provider of merchant Wafer Level Packaging (WLP) and flip chip bumping to the semiconductor market through its Phoenix Arizona facility and five global licensees. Services provided include: Standard Flip Chip (SFC, formally known as Flex-on-Cap"!), Redistributed SFC, Wafer UltraCSP"!, Spheron"! (High Frequency RF Packaging), EliteCSP"! (a low cost E-less Nickel bumping WLCSP), and Polymer Collar"!. FlipChip provides turn-key wafer bumping services from engineering prototypes to high volume manufacturing."